
MR2A16A
Figure 12 – 48-FBGA Packge Outline
Notes:
1. Dimensions in Millimeters.
2. Dimensions and tolerances per ASME Y14.5M
- 1994.
3. Maximum solder ball diameter measured paral -
lel to DATUM A
4. DATUM A, the seating plane is determined by
the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any ef -
fect of mark on top surface of package.
Copyright ? Everspin Technologies 2013
18
MR2A16A Rev. 11, 10/2013